A brief introduction
The BX51IR microscope can perform non-destructive examination and analysis on areas that are not visible to the naked eye, as well as a specialized microscope for near-infrared observation. Able to perform non-destructive CPS bumping observations on the interior of semiconductor chips and the back of integrated circuit components.
A detailed introduction to metallographic microscopy
Olympus scientific grade upright system microscope BX51/BX51M-IR
Microscope for near-infrared external transmission reflection observation
5X to 10X infrared lenses with aberration correction covering the entire wavelength range from visible light to near-infrared
Suitable for observing the interior of wafers, compound semiconductors, packaged chips, and CSP bumps
Main features:
1. UIS infinite distance correction optical system provides excellent image quality
2. Further improvement in ergonomics to make operation more comfortable
3. Multiple highly functional attachments that can meet various inspection needs
Main technical specifications of BX51M-IR
The BX51M-IR and BX51 microscopes have the same body and reflective lighting device, allowing for near-infrared observation of the interior of semiconductors, as well as observation of the interior of packaged chips and CSP bumps.
